TSMC Zhang Xiaoqiang: Customer demand for AI chips is “never-ending” to compete for computing power

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Summary of article:

Zhang Xiaoqiang said that the demand for computing power is increasing in the AI ​​​​era, and will benefit from TSMC’s advanced processes and advanced packaging. The Japanese market also shows growth potential due to AI and robot applications.

TSMC Zhang Xiaoqiang, senior deputy general manager and deputy co-chief operating officer, said in Tokyo on the 11th that the market demand for TSMC’s advanced process chips is “never-ending”.

Zhang Xiaoqiang pointed out at the 2026 Nikkei Global Management Forum that TSMC’s customers and even their customers’ customers believe that computing power has become the most important resource in the AI ​​​​era.

Companies are doing their best to achieve more computing power, and customers continue to move towards more advanced processes, upgrading from 5 nanometers to the latest 2 nanometers.

He also emphasized that we cannot rely only on transistor and wafer process technology to meet the needs of AI in the future. Advanced packaging will play an important role.

talking aboutJapan Regarding the market, Zhang Xiaoqiang said that Japan currently accounts for only 4% of TSMC’s global revenue, but its technology and applications are diverse and its development potential is huge.

He is particularly optimistic about “physical AI” that combines AI and robotics technology, which he believes will create new demand for advanced semiconductors.

Summary FAQ


  • He believes that customers and even customers of customers are competing for computing power. There is almost no upper limit to the demand for AI chips and advanced processes. The market demand for TSMC’s high-end processes can be said to be endless.


  • Zhang Xiaoqiang pointed out that customers are moving towards advanced nodes beyond 5 nanometers, and the latest target has reached 2 nanometers, indicating that companies are actively upgrading chip manufacturing processes to achieve greater computing power.


  • He emphasized that we cannot rely solely on transistor and wafer processes to meet AI needs in the future. Advanced packaging will play an important role. In addition, he is also optimistic about the Japanese market and the new demands brought by physical AI.

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